Systems For Forming Aggregate Materials From Heat Fusable Powered Materials

ABSTRACT

In one embodiment, a system for forming aggregate materials may include a lower open-topped mold, an upper mold, an actuation assembly, a heating system, a pressure sensor, and a controller. The lower open-topped mold can receive a heat moldable material that can include a foaming agent. The lower open-topped mold can contact the heat moldable material and the upper mold can contact the heat moldable material. The controller can execute machine readable control logic to cause the actuation assembly to generate relative outward motion at an expansion rate. The foaming agent can expand the heat moldable material when heated. During outward motion, the lower open-topped mold can maintain close contact with the heat moldable material, and the upper mold can maintain close contact with the heat moldable material. The expansion rate of the relative outward motion can be based upon a pressure signal indicative of back pressure.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a continuation-in-part of U.S. PatentApplication Serial No. 12/960,028 filed Dec. 3, 2010, which itselfclaims priority to United Kingdom GB 1005058.1 filed on Mar. 25, 2010.All of the above applications are incorporated by reference herein intheir entirety.

TECHNICAL FIELD

The present specification generally relates to systems for formingaggregate materials from heat fusable powdered materials and, morespecifically, to systems for forming aggregate materials from heatfusable powdered materials including a foaming agent.

BACKGROUND

There are a number of known processes for forming plastics materialsinto the required shapes for making relatively small articles, such asinjection molding, but such processes become progressively moreunwieldy, and the associated equipment becomes much more expensive, whenit is required to make relatively large panels such as building panelssuitable for use as partitions, for example.

It is known to produce composite panels based on fibrous materials byforming a fiber layer or mat and then applying outer layers ofexpandable phenol resin and hot-pressing the assembly to consolidate it.Such a method of forming boards is described in U.S. Pat. No. 4,734,231(Morita et al). JP2003112329 discloses a similar kind of boardcomprising a core of mixed carbon material and phenol resin powder, anda surface material comprising mixed solid phenol resin and chaff orstraw, which is formed by compressing the mixtures and heating tocross-link the phenol resin. However, panels including such fibrousmaterials may not be sufficiently dense or strong for general buildingor construction purposes, and it is also difficult to achieve a smoothfinish on the outer surface.

Furthermore, if it is desired to utilize ground-up recycled wastematerial (for example) to make a more solid core, it is difficult tomake a strong integral structure without employing a multi-stage processin which the core material is first combined with a binding material.This is because the thermoplastic material of the outer layer may notpenetrate the core layer sufficiently to bind it together.

It is also known to make structural panels from molded material, byseparately forming relatively thin panels from a first, more finegrained material so as to provide a relatively well finished “skin”, andthen arranging a pair of the relatively thin panels in a suitable moldor former, with a space between them in which another plastics materialis formed into a foam, so as to provide a composite structure which isrelatively strong, and may also be relatively coarse grained or containa large volume of voids, so as to provide the resulting compositestructure with good insulating qualities.

As an alternative to plastics or molded materials for the externalskins, of course, sheets of metal or other suitable sheet material maybe utilized, but in any case the formation of such panels byconventional methods tends to involve a relatively slow and cumbersomemulti-stage process, because of the necessity to pre-form somecomponents and then to manipulate them into the required arrangement forforming the final structure. Where it is required to manufacturerelatively large structural panels, for instance, sizes such as 2.4m×1.2 m, it is consequently expensive to automate such known systemsbecause of the need for complex handing equipment.

Accordingly, a need exists for alternative systems for forming aggregatematerials from heat fusable powdered materials.

SUMMARY

In one embodiment, a system for forming aggregate materials may includea lower open-topped mold, an upper mold, an actuation assembly, aheating system, a pressure sensor, and a controller. The loweropen-topped mold can receive a heat moldable material that can include afoaming agent. The upper mold can cooperate with the lower open-toppedmold to form an enclosure. The actuation assembly can be coupled to thelower open-topped mold, the upper mold, or both to generate relativeinward motion between the lower open- topped mold and the upper mold andrelative outward motion between the lower open-topped mold and the uppermold. The heating system can be in thermal communication with the loweropen-topped mold and the upper mold. The pressure sensor can be operablycoupled to the lower open-topped mold, the upper mold, or both. Thepressure sensor can transmit a pressure signal indicative of backpressure provided by the heat moldable material. The controller can becommunicatively coupled to the actuation assembly and the heatingsystem. When the heat moldable material is received by the loweropen-topped mold, the controller can execute machine readable controllogic to generate relative inward motion of the lower open-topped moldand the upper mold with the actuation assembly to enclose the heatmoldable material. The lower open-topped mold can contact the heatmoldable material and the upper mold can contact the heat moldablematerial. The controller can execute machine readable control logic toheat the lower open-topped mold and the upper mold with the heatingsystem to a foaming temperature. The foaming temperature can fuse theheat moldable material and activate the foaming agent. The controllercan execute machine readable control logic to receive the pressuresignal from the pressure sensor. The controller can execute machinereadable control logic to cause the actuation assembly to generaterelative outward motion at an expansion rate. The foaming agent canexpand the heat moldable material. During outward motion, the loweropen-topped mold can maintain close contact with the heat moldablematerial, and the upper mold can maintain close contact with the heatmoldable material. The expansion rate of the relative outward motion canbe based upon the pressure signal.

In another embodiment, a system for forming aggregate materials mayinclude a lower open-topped mold, an upper mold, an actuation assembly,a heating system a pressure sensor, and a controller. The loweropen-topped mold can receive a heat moldable material. The heat moldablematerial may include a lower layer and an upper layer of relatively finegrain material, and a core layer of relatively coarse grain materialdisposed between the lower layer and the upper layer, the core layer mayinclude a foaming agent. The upper mold can cooperate with the loweropen-topped mold to form an enclosure. The actuation assembly can becoupled to the lower open-topped mold, the upper mold, or both togenerate relative inward motion between the lower open-topped mold andthe upper mold and relative outward motion between the lower open-toppedmold and the upper mold. The heating system can be in thermalcommunication with the lower open-topped mold and the upper mold. Thepressure sensor can be operably coupled to the lower open-topped mold,the upper mold, or both. The pressure sensor can transmit a pressuresignal indicative of back pressure provided by the heat moldablematerial. The controller can be communicatively coupled to the actuationassembly and the heating system. When the heat moldable material isreceived by the lower open-topped mold, the controller can executemachine readable control logic to generate relative inward motion of thelower open-topped mold and the upper mold with the actuation assembly toenclose the heat moldable material. The lower open-topped mold cancontact the heat moldable material and the upper mold can contact theheat moldable material. The controller can execute machine readablecontrol logic to heat the lower open-topped mold and the upper mold to apre-heat temperature with the heating system. The pre-heat temperaturecan fuse the upper layer and/or the lower layer of the heat moldablematerial and not activate the foaming agent. The controller can executemachine readable control logic to heat the lower open-topped mold andthe upper mold from the pre-heat temperature to a foaming temperaturewith the heating system. The foaming temperature can activate thefoaming agent. The controller can execute machine readable control logicto receive the pressure signal from the pressure sensor. The controllercan execute machine readable control logic to generate relative outwardmotion of the lower open-topped mold and the upper mold at an expansionrate with the actuation assembly. The foaming agent can expand the heatmoldable material. During the outward motion, the lower open-topped moldcan maintain close contact with the heat moldable material, and theupper mold can maintain close contact with the heat moldable material.The expansion rate of the relative outward motion can be based upon thepressure signal.

In yet another embodiment, a system for forming aggregate materials mayinclude a lower open-topped mold, an upper mold, an actuation assembly,a heating system, a cooling system, a pressure sensor, and a controller.The lower open-topped mold can receive a heat moldable materialincluding a foaming agent. The upper mold can cooperate with the loweropen-topped mold to form an enclosure. The actuation assembly can becoupled to the lower open-topped mold, the upper mold, or both togenerate relative inward motion between the lower open-topped mold andthe upper mold and relative outward motion between the lower open-toppedmold and the upper mold. The heating system can be in thermalcommunication with the lower open-topped mold and the upper mold. Thecooling system can be in thermal communication with the loweropen-topped mold and the upper mold. The pressure sensor can be operablycoupled to the lower open-topped mold, the upper mold, or both. Thepressure sensor can transmit a pressure signal indicative of backpressure provided by the heat moldable material. The controller can becommunicatively coupled to the actuation assembly, the heating system,and the cooling system. When the heat moldable material is received bythe lower open-topped mold, the controller can execute machine readablecontrol logic to generate relative inward motion of the loweropen-topped mold and the upper mold with the actuation assembly toenclose the heat moldable material. The lower open-topped mold cancontact the heat moldable material and the upper mold contacts the heatmoldable material. The controller can execute machine readable controllogic to heat the lower open-topped mold and the upper mold to apre-heat temperature with the heating system. The pre-heat temperaturemay fuse the heat moldable material and not activate the foaming agent.The controller can execute machine readable control logic to heat thelower open-topped mold and the upper mold from the pre-heat temperatureto a foaming temperature with the heating system. The foamingtemperature can activate the foaming agent. The controller can executemachine readable control logic to receive the pressure signal from thepressure sensor. The controller can execute machine readable controllogic to generate relative outward motion of the lower open-topped moldand the upper mold at an expansion rate with the actuation assembly. Thefoaming agent can expand the heat moldable material. During the outwardmotion, the lower open-topped mold can maintain close contact with theheat moldable material, and the upper mold can maintain close contactwith the heat moldable material. The expansion rate of the relativeoutward motion can be based upon the pressure signal. The controller canexecute machine readable control logic to cool the lower open-toppedmold and the upper mold from the foaming temperature with the coolingsystem. The controller can execute machine readable control logic togenerate relative inward motion of the lower open-topped mold and theupper mold at a contraction rate with the actuation assembly. During theinward motion, the lower open-topped mold can maintain close contactwith the heat moldable material, and the upper mold can maintain closecontact with the heat moldable material. The contraction rate of therelative outward motion can be based upon the pressure signal.

These and additional features provided by the embodiments describedherein will be more fully understood in view of the following detaileddescription, in conjunction with the drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The embodiments set forth in the drawings are illustrative and exemplaryin nature and not intended to limit the subject matter defined by theclaims. The following detailed description of the illustrativeembodiments can be understood when read in conjunction with thefollowing drawings, where like structure is indicated with likereference numerals and in which:

FIG. 1 schematically depicts a system for forming aggregate materialsaccording to one or more embodiments shown and described herein;

FIG. 2A schematically depicts a process for forming aggregate materialsaccording to one or more embodiments shown and described herein;

FIG. 2B schematically depicts a process for forming aggregate materialsaccording to one or more embodiments shown and described herein;

FIG. 3 depicts a flow chart of exemplary control logic for formingaggregate materials according to one or more embodiments shown anddescribed herein;

FIG. 4 depicts a flow chart of exemplary control logic for formingaggregate materials according to one or more embodiments shown anddescribed herein; and

FIG. 5 depicts a flow chart of exemplary control logic for formingaggregate materials according to one or more embodiments shown anddescribed herein.

DETAILED DESCRIPTION

As used herein with the various illustrated embodiments described below,the following terms include, but are not limited to, the followingmeanings.

The term “sensor” means a device that detects a physical quantity andconverts it into a signal that is correlated to the detected value ofthe physical quantity.

The term “signal” means a waveform (e.g., electrical, optical, magnetic,or electromagnetic waveforms) capable of traveling through a medium suchas DC, AC, sinusoidal-wave, triangular-wave, square-wave, and the like.

The phrase “communicatively coupled” means that components are capableof exchanging data signals with one another such as, for example,electrical signals via conductive medium, electromagnetic signals viaair, optical signals via optical waveguides, and the like.

FIG. 1 generally depicts one embodiment of a system for formingaggregate materials. The system generally comprises an upper mold, alower open-topped mold, an actuation assembly for generating relativemotion between the molds and a heating system for heating the molds.Various embodiments of the system for forming aggregate materials andthe operation of the system will be described in more detail herein.

Referring now to FIG. 1, the system 10 may comprise a lower open-toppedmold 20 for imparting a shape upon a raw material. The lower open-toppedmold 20 can comprise one or more sidewalls 24 that that are configuredto surround raw material that is shaped by the mold and a base 25 thatcooperates with the one or more sidewalls 24 to form a mold shape. Thelower open-topped mold 20 may be coupled to a lower support structure 22that is capable of supporting the lower open-topped mold 20 andwithstanding repeated actuation, as is described in greater detailherein.

The system 10 may further comprise an upper mold 30 that cooperates withthe lower open-topped mold 20 to impart a shape upon a raw material. Forexample, the upper mold 30 and the lower open-topped mold 20 maycooperate and interlock such that a raw material is substantiallyenclosed throughout a molding process. The upper mold 30 may be coupledto an upper support structure 32 that is capable of durably supportingthe upper mold 30 for multiple molding cycles, i.e., the molds may beused in repeated cycles to produce a high volume of molded articles. Thelower open-topped mold 20 and the upper mold 30 may be formed from anymaterial suitable to withstand repeated thermodynamic cycling whilemaintaining a substantially controlled shape such as, for example, ametallic (e.g., aluminum) or ceramic. Furthermore, it is noted that thelower support structure 22 and the upper support structure 32 may beformed from similar materials as the lower open-topped mold 20 and theupper mold 30 or any other material having substantially similar orlower thermal conductivity.

Referring still to FIG. 1, the system 10 may further include anactuation assembly 12 for generating relative motion between the loweropen-topped mold 20 and the upper mold 30. Specifically, the actuationassembly 12 can be utilized to control the position of the loweropen-topped mold 20 and the upper mold 30 to allow raw material to beloaded into the lower open-topped mold 20. Moreover, the actuationassembly 12 may provide pressure to the lower open-topped mold 20 andthe upper mold 30 while the raw material is being shaped by the loweropen-topped mold 20 and the upper mold 30. The actuation assembly 12 mayinclude any number of actuators capable of transferring a controlledamount of force upon the lower open-topped mold 20, the upper mold 30,or both. For example, such actuators may be pneumatic, electrical,hydraulic, or any other device capable of transforming an input signalinto motion. Moreover, each actuator may be linear or rotary. In someembodiments, the actuation assembly 12 may comprise a linear actuatordisposed at each corner of a square shaped support structure coupled toupper mold 30.

The system 10 may comprise a heating system for providing thermal energyto an endothermic molding process. Specifically, the heating system mayinclude a plurality of heating devices 14 in thermal communication withthe lower open-topped mold 20 and the upper mold 30 that cause the rawmaterial to achieve a higher temperature. The heating devices may beelectrical resistive heating elements, inductive heating elements, orany other device capable of transferring a substantially even amount ofthermal energy across a surface of the raw material and/or a surface ofa mold. The thermal energy can be produced by the heating devices 14 andthen transferred to the raw material by conduction, convection orradiation. Accordingly, it is noted that while, the heating devices 14are depicted FIG. 1 as being located within the upper support structure32 and the lower support structure 22, the heating devices 14 may belocated external to the upper support structure 32, the lower supportstructure 22, the upper mold 30 and/or the lower open-topped mold 20.The heating devices 14 may alternatively or additionally be locatedwithin the upper mold 30 and/or the lower open-topped mold 20.

The system 10 may further comprise a cooling system for reducing thetemperature of the raw material. For example, the cooling system mayinclude a plurality of cooling devices 16 in thermal communication withthe lower open-topped mold 20 and the upper mold 30. The cooling devices16 may be flow paths through which a cooling fluid is directed to removeheat from the raw material, or any other device capable of removingthermal energy from the raw material by conduction, convection orradiation. Furthermore, it is noted that while, the cooling devices 16are depicted FIG. 1 as being located within the upper support structure32 and the lower support structure 22, the cooling devices 16 may belocated external to the upper support structure 32, the lower supportstructure 22, the upper mold 30 and/or the lower open-topped mold 20.The cooling devices 16 may alternatively or additionally be locatedwithin the upper mold 30 and/or the lower open-topped mold 20.

The system 10 may further comprise a pressure sensor 34 for measuringthe back pressure provided by the raw material during a molding process.Accordingly, the pressure sensor 34 may be any sensor capable ofdetecting the resistive force of the raw material during processing suchas, but not limited to, a load cell, a force transducer, an absolutepressure sensor, a gauge pressure sensor, or a differential pressuresensor. It is noted that, while the pressure sensor 34 is depicted asbeing located within the upper mold 30, the pressure sensor 34 may belocated anywhere in the system 10 such that the pressure sensor isoperable to detect the back pressure of the raw material such as, forexample, within the lower open-topped mold 20, the upper mold 30, theupper support structure 32, the lower support structure 22, theactuation assembly 12, or combinations thereof.

The system 10 may also comprise a position sensor 36 for detecting theposition of the lower open-topped mold 20 and/or the upper mold 30.Specifically, the absolute and/or relative position of each of the loweropen-topped mold 20 and the upper mold 30 may be detected along a singleaxis or multiple axes. Accordingly, the position sensor 36 may be anysensor capable of detecting linear and/or angular position such as anencoder, an optical sensor, an electrical sensor, and the like. It isnoted that, while the position sensor 36 is depicted as being locatedwithin the upper mold 30 and the lower open- topped mold 20, theposition sensor 36 may be located anywhere in the system 10 such thatthe position sensor 36 is operable to detect the lower open-topped mold20 and the upper mold 30 such as, for example, within the actuationassembly 12, the lower open-topped mold 20, the upper mold 30, the uppersupport structure 32, the lower support structure 22, the actuationassembly 12, or combinations thereof.

The system 10 may comprise a temperature sensor 38 for detecting thetemperature of the raw material. The temperature sensor 38 may be anysensor capable of detecting the temperature of the raw material directlyor indirectly by measuring the temperature of the other components ofthe system 10. The temperature sensor 38 may include any device capableof detecting temperature such as, but not limited to, a thermometer, athermocouple, a thermostat, infrared detector, and the like. It is notedthat, while the temperature sensor 38 is depicted as being locatedwithin the upper mold 30 and the lower open-topped mold 20, thetemperature sensor 38 may be located anywhere in the system 10 such thatthe temperature sensor 38 is operable to detect the temperature ofand/or in thermal communication with the raw material such as, forexample, within the lower open- topped mold 20, the upper mold 30, theupper support structure 32, the lower support structure 22, theactuation assembly 12, or combinations thereof.

The system 10 comprises a controller 26 for executing machine readableinstructions to control various aspects of the molding process. Thecontroller 26 may be a processor, an integrated circuit, a microchip, acomputer, programmable logic controller or any other computing devicecapable of executing machine readable instructions. The controller 26may be communicatively coupled to a memory such as RAM, ROM, EPROM,EEPROM, a flash memory, a hard drive, or any device capable of storingmachine readable instructions. Accordingly, the memory may store moldingcontrol logic and/or process recipes.

Thus, embodiments of the present disclosure may comprise control logicor an algorithm written in any programming language of any generation(e.g., 1GL, 2GL, 3GL, 4GL, or 5GL) such as, e.g., machine language thatmay be directly executed by the controller, or assembly language,object-oriented programming (OOP), scripting languages, microcode, etc.,that may be compiled or assembled into machine readable instructions andstored on a machine readable medium. Alternatively, the logic oralgorithm may be written in a hardware description language (HDL), suchas implemented via either a field-programmable gate array (FPGA)configuration or an application-specific integrated circuit (ASIC), andtheir equivalents.

Referring still to FIG. 1, one embodiment of the system 10 for formingaggregate materials is depicted. The system 10 may comprise an uppersupport structure 32 that is configured to move up and down a verticalaxis (depicted in FIG. 1 as the y-axis). For example, the upper supportstructure 32 may be slidingly engaged with a plurality of verticalrisers 33. The actuation assembly 12 can be coupled to the upper supportstructure 32 to transport the upper support structure 32 vertically. Thesystem 10 may further comprise a lower support structure 22 that can bepositioned below the upper support structure 32. Accordingly, when theupper support structure 32 moves along the vertical axis, the distancebetween the upper support structure 32 and the lower support structure22 can be adjusted by the actuation assembly 12.

As is noted above, an upper mold 30 may be coupled to the upper supportstructure 32 and a lower open-topped mold 20 may be coupled to the lowersupport structure 22. Accordingly, the actuation assembly 12 cangenerate relative inward motion between the lower open-topped mold 20and the upper mold 30 and relative outward motion between the loweropen-topped mold 20 and the upper mold 30. Specifically, in theembodiment depicted in FIG. 1, the actuation assembly 12 may move theupper support structure 32 in the negative y-direction to cause relativeinward motion between the lower open-topped mold 20 and the upper mold30. The actuation assembly 12 may move the upper support structure 32 inthe positive y-direction to cause relative inward motion between thelower open-topped mold 20 and the upper mold 30.

Thusly, the actuation assembly 12 may move the upper mold 30 throughouta range of positions that may include and be bounded by an open positionand a clamped position. In the open position, the upper mold 30 can bemoved away from the lower open-topped mold 20 such that the upper mold30 is separated from the from the lower open-topped mold 20 along they-axis. In the clamped position, the actuation assembly 12 forces theupper mold 30 into contact with the lower open-topped mold 20 such thatfurther motion of the upper mold 30 along the negative y-direction islimited by the lower open-topped mold 20. It is noted that, while theactuation assembly 12 is depicted in FIG. 1 as being coupled to theupper support structure 32, the actuation assembly 12 may alternativelyor additionally be coupled to any component of the system 10 such as thelower support structure 22, or any other component sufficient to allowthe upper mold 30 and the lower open-topped mold 20 to move throughoutan open position, a clamped position, and/or any position there between.

In some embodiments, the system 10 may comprise a conveyance system 18for moving the lower support structure 22 laterally (depicted in FIG. 1as along the x-axis). Accordingly, the lower open-topped mold 20 can bemoved in and out of alignment with the upper mold 30. Furthermore, it isnoted that, while the conveyance system 18 is depicted in FIG. 1 as aroller conveyer, the conveyance system 18 may be any motive systemcapable of moving the lower support structure 22. For example, theconveyance system 18 may include belts, enclosed tracks, I-Beams,towlines, and/or manually actuated rollers and/or wheels. Moreover, itis noted that, while the conveyance system 18 is depicted in FIG. 1 asbeing linear and accommodating two lower support structures 22, theconveyance system 18 may be any shape and may accommodate any number oflower support structures 22 for batch processing of aggregate materials.

The controller 26 can be communicatively coupled to various componentsof the system 10 and execute machine readable control logic to shape rawmaterial into an aggregate material. In some embodiments, the controller26 can be communicatively coupled to the actuation assembly 12, heatingdevices 14, cooling devices 16, pressure sensors 34, position sensors 36and temperature sensors 38. Accordingly, the controller 26 followcontrol logic to direct the system 10 in forming a heat moldablematerial 40 into an aggregate material 60 according to a process recipe.

The heat moldable material 40 may be a thermoplastic such as, forexample, polyolefins (e.g. polyethylenes, styrenics such as polystyrene,polyesters such as PET), thermosets (e.g. phenolics) and rubbers. Theheat moldable material 40 generally comprises a temperature and/or achemically activated foaming agent (blowing agent) such as, for example,exothermics, endothermics, and/or physical systems. Accordingly, thefoaming agent may have an activation temperature at which the foamingagent forms a foam which causes expansion of the heat moldable material40. Suitable exothermics include, but are not limited to,azodicarbonamide (e.g., Porofor® available from Lanxess or Celogen®available from Lion Copolymer), or sodium bicarbonate. Suitableendothermics include, but are not limited to, hydroxypropanetricarboxylic acid (e.g. Hydrocerol® available from Clariant). Physicalsystems can include for example nitrogen, pentane, or other gases, whichcan be preimpregnated in polystyrene or expanded polypropylene andreleased as a gas. Alternatively, nitrogen can be utilized in a systemsuch as a “Zotefoam” nitrogen saturation process.

The heat moldable material 40 may comprise one or more distinct layers.For example, the heat moldable material 40 may comprise a lower layer42, an upper layer 46 and a core layer 44 disposed between the lowerlayer 42 and the upper layer 46. The lower layer 42 may compriserelatively fine grain material that forms a lower surface 50. Similarly,the upper layer 46 may comprise relatively fine grain material thatforms an upper surface 48. The fine grain material can be athermoplastic powder (e.g. polyethylene) where the average grain size isabout 100 μm to about 3,000 μm in one embodiment, and in anotherembodiment, for example, from about 500 μm to about 100 μm. Accordingly,heat moldable material 40 may be processed as described herein to forman aggregate material 60 having a lower skin layer 62 formed from thelower layer 42 and an upper skin layer 66 formed from the upper layer46. It is believed, without being bound to theory, that the relativelyfine grain material conforms more completely to the upper mold 30 andthe lower open-topped mold relatively closely. Accordingly, the uppersurface 68 and lower surface 70 may be made relatively smooth withsmooth molds or may be made to more closely replicate the desired moldshape (e.g., to simulate natural stone, brick, timber, or any otherbuilding material).

The core layer 44 of the heat moldable material 40 may comprise afoaming agent. In some embodiments, the core layer may be formed from arelatively coarse grain material compared to the lower layer 42 and theupper layer 46. The coarse grain material can be a thermoplastic powder(e.g. polyethylene) where the average grain of up to about 10 mm.Moreover, the core layer may further comprise filler material such as,for example, recycled material (e.g., paper, cardboard, rubber,plastics, metal, fibers and minerals), glass fiber, carbon fiber,reinforcement steel mesh, organic fiber (e.g., bamboo or banana), ormaterial intended to add specific properties (e.g., fire-retardantmaterial or anti-ballistic material). Accordingly, the core layer 44 maycomprise thermoplastics, foaming agents, and filler material inproportions suitable to allow the core layer 44 to fuse with the lowerlayer 42 and the upper layer 46 to form an aggregate material 60.

Referring collectively to FIGS. 2A and 2B, one embodiment of a methodfor forming an aggregate material is schematically depicted. At step110, the lower layer 42 can be dispensed into the lower open-topped mold20, such that the lower surface 50 is in contact with the loweropen-topped mold 20. At step 120, the core layer 44 can be dispensedinto the lower open-topped mold 20 over the lower layer 42. As is notedabove, the core layer 44 may include foaming agents and filler material.The foaming agent and/or the filler material may be pre-mixed with thecore layer 44 and dispensed simultaneously as a constituent of the corelayer 44. Additionally or alternatively, each of the core layer 44constituents can be dispensed as individual layers.

At step 130, the upper layer 46 can be dispensed into the loweropen-topped mold 20 over the core layer 44. Each of the lower layer 42,the core layer 44, and the upper layer 46 can be dispensed into thelower open-topped mold by a powder dispensing unit (not depicted). Thepowder dispensing unit can be any device capable of loading measuredamounts of fine grain material and/or coarse grain material. In someembodiments, the sidewalls 24 and the base 25 of the lower open-toppedmold 20 can move vertically with respect to one another to assist withthe loading of the heat moldable material 40. For example, the sidewalls24 may be lowered to a predetermined location with respect to the base25 when one or more layers of the heat moldable material 40 aredispensed. A roller or a plane tool may be indexed by the sidewalls 24and remove excess material that extends above the sidewall 24 to ensurethe desired amount of material is loaded in the lower open- topped mold20.

Referring back to FIG. 1, it is noted that, the heat moldable material40 may be dispensed into the lower open-topped mold 20, when the loweropen-topped mold 20 is not aligned with the upper mold 30. Accordingly,heat moldable material 40 may be loaded into one or more loweropen-topped molds 20 by one or more powder dispensing units, whileanother lower open-topped mold 20 is aligned with the upper mold 30.

Referring collectively to FIGS. 1 and 2A, at step 140 a loweropen-topped mold 20 housing the heat moldable material 40 may be alignedwith the upper mold 30. For example, position sensors 36 may detect theorientation of the lower open-topped mold 20 and the upper mold 30 alongthe x-axis and the z-axis. When the lower open-topped mold 20 and theupper mold 30 are detected as being aligned by the position sensors 36,the controller 26 can cause the actuation assembly 12 to generaterelative inward motion of the lower open-topped mold 20 and the uppermold 30. The upper mold 30 can be lowered into contact with the uppersurface 48 of the heat moldable material 40, and the lower open-toppedmold 20 can contact the lower surface 50 of the heat moldable material40. Accordingly, the heat moldable material 40 can be enclosed by thelower open-topped mold 20 and the upper mold 30.

Referring collectively to FIGS. 1 and 2B, the embodiments describedherein may optionally include step 150 and step 160. At step 150, thelower open-topped mold 20 and the upper mold 30 can be heated with theheating system to a pre-heat temperature. The pre-heat temperature maybe any temperature wherein the lower layer 42 and the upper layer 46fuses into a viscous material and the foaming agent remains below itsactivation temperature. For example, in one embodiment, the pre-heattemperature can be up to about 350° C., in another embodiment, such asfor example, from about 130° C. to about 310° C., in still anotherembodiment, from about 190° C. to about 220° C., and in yet anotherembodiment, about 170° C. At step 160, the lower layer 42 can be fusedinto a viscous lower layer 58 and the upper layer 46 can be fused into aviscous upper layer 56. The controller 26 can cause the actuationassembly 12 to generate relative inward motion between the loweropen-topped mold 20 and the upper mold 30.

Referring collectively to FIGS. 1 and 3, the viscous lower layer 58 andthe viscous upper layer 56 can be formed according to a flow process200. At step 202, the lower open-topped mold 20 and the upper mold 30can be heated to the pre-heat temperature. At step 204, the controller26 can receive a position measurement from the position sensor 36. Thecontroller 26 can determine if the position indicates that the combinedthickness of the fusing material has reached a desired thickness. Thedesired thickness can be set in accordance with the process recipe andcan be about 10 mm for a process recipe for making a building board. Ifthe measured thickness is less than or equal to the desired thickness(indicated in FIG. 3 with a “+”), the controller 26 can cause the flowprocess to proceed to step 212. At step 212, the flow process ends.

If the measured thickness is greater than the desired thickness(indicated in FIG. 3 with a “−”), the controller 26 can cause the flowprocess 200 to proceed to step 206. At step 206, the controller 26 canreceive a force measurement from the pressure sensor 34. The controller26 can determine if the force measurement exceeds a flow force limit.The flow force limit can be set in accordance with the process recipeand can be from about 0.2 kN to about 1 kN in one embodiment, and inanother embodiment, for example, about 0.5 kN such as for a processrecipe for making a building board. If the force measurement exceeds theflow force limit (indicated in FIG. 3 with a “+”), the controller 26 cancause the flow process to proceed to step 212. If the force measurementdoes not exceed the flow force limit (indicated in FIG. 3 with a “−”),the controller 26 can cause the flow process to proceed to step 208.

At step 208, the controller 26 can receive a force measurement from thepressure sensor 34. The controller 26 can determine if the forcemeasurement is less than the flow force limit. If the force measurementis less than the flow force limit (indicated in FIG. 3 with a “+”), thecontroller 26 can cause the flow process to proceed to step 210. At step210, the controller 26 can cause the actuation assembly 12 toincrementally move to generate relative inward motion between the loweropen-topped mold 20 and the upper mold 30. The size of the increment maybe set such that in operation the molds move at a desired rate. Thedesired rate can be set in accordance with the process recipe. Thedesired rate can be less than about 2 mm/minute in one embodiment, andin another embodiment, for example, about 1.6 mm/min (about 0.026mm/sec) such as for a process recipe for making a building board. If theforce measurement is not less than the flow force limit (indicated inFIG. 3 with a “−”), the controller 26 can cause the flow process toproceed back to step 204.

Referring again to FIG. 2B, the upper mold 30 and the lower open-toppedmold 20 can be heated to a foaming temperature at step 170. The foamingtemperature can be any temperature suitable to cause the foaming agentto reach its activation temperature. For example, the foaming agent canbe heated to its activation temperature causing the core layer 44 totransform into a foam 54. In some embodiments, filler material can beinserted into the foam 54 through the sidewalls 24 of the loweropen-topped mold 20. As the foam 54 expands, the foam exerts a force(i.e., back pressure) upon the upper mold 30 and the lower open-toppedmold 20. The upper mold 30 and the lower open-topped mold 20 can bemoved outward with respect to one another based upon the back pressure.Accordingly, the lower open-topped mold 20 and the upper mold 30 canmaintain close contact with the heat moldable material 40.

Referring collectively to FIGS. 1 and 4, the foam 54 can be formedaccording to a foam process 300. At step 302, the lower open-topped mold20 and the upper mold 30 can be heated to the foaming temperature. Thefoaming temperature may be any temperature wherein the heat moldablematerial 40 fuses and the foaming agent reaches its activationtemperature. For example, in one embodiment the foaming temperature canbe up to about 350° C., in another embodiment, such as for example, fromabout 140° C. to about 280° C., in still other embodiment from about190° C. to about 220° C., and about 210° C. in yet another embodiment.

At step 304, the controller 26 can receive a foam force measurement fromthe pressure sensor 34. The controller 26 can determine if the foamforce measurement exceeds a foam force limit plus a foam tolerance. Thefoam force limit and the foam tolerance can be set in accordance withthe process recipe. The foam force limit can be in one embodiment fromabout 1 kN to about 20 kN, and in another embodiment, for example, about0.5 kN such as for a process recipe for making a building board. Thefoam tolerance can be in one embodiment from about 0 kN to about 5 kN,and in another embodiment, for example, about 0.2 kN such as for aprocess recipe for making a building board. If the foam forcemeasurement exceeds the foam force limit plus the foam tolerance(indicated in FIG. 5 with a “+”), the controller 26 can cause the foamprocess 300 to proceed to step 306. At step 306, the controller 26 cancause the actuation assembly 12 to incrementally generate relativeoutward motion between the lower open-topped mold 20 and the upper mold30. The size of the increment may be set such that in operation themolds move at an expansion rate sufficient to respond to the rate ofexpansion of the foaming agent at the foaming temperature. Followingstep 306, the controller 26 can cause the foam process 300 to proceed tostep 304.

If the foam force measurement does not exceed the foam force limit plusthe foam tolerance (indicated in FIG. 4 with a “−”), the controller 26can cause the flow process to proceed to step 308. At step 308, thecontroller 26 can receive a foam force measurement from the pressuresensor 34. The controller 26 can determine if the foam force measurementis less than a foam force limit minus the foam tolerance. If the foamforce measurement is less than the foam force limit minus the foamtolerance (indicated in FIG. 5 with a “+”), the controller 26 can causethe foam process 300 to proceed to step 310. At step 310, the controller26 can cause the actuation assembly 12 to incrementally generaterelative inward (i.e., bringing together) motion between the loweropen-topped mold 20 and the upper mold 30. The size of the increment maybe set such that in operation the molds move at a contraction ratesufficient to respond to the rate of contraction of the foaming agentduring the foaming process. Following step 310, the controller 26 cancause the foam process 300 to proceed to step 304.

If the foam force measurement is greater than the foam force limit minusthe foam tolerance (indicated in FIG. 4 with a “−”), the controller 26can cause the foam process 300 to proceed to step 312. At step 312, thecontroller 26 can receive a position measurement from the positionsensor 36. The controller 26 can determine if the position indicatesthat the heat moldable material 40 is less than a nominal thickness plusa foam offset. The nominal thickness and the foam offset can be set inaccordance with the process recipe. For example, the nominal thicknesscan be in one embodiment from about 5 mm to about 50 mm, in anotherembodiment about 8 mm to about 20 mm, and in still another embodiment,for example, about 8 mm such as for a process recipe for making abuilding board. The foam offset can be in one embodiment from about 0.2mm to about 1.5 mm, and in another embodiment, for example, about 1 mmsuch as for a process recipe for making a building board. If themeasured thickness is less the heat moldable material 40 is less than anominal thickness plus a foam offset (indicated in FIG. 5 with a “+”),the controller 26 can cause the foam process 300 to proceed back to step304.

If the measured thickness of the heat moldable material 40 is greaterthan or equal to the nominal thickness plus the foam offset (indicatedin FIG. 4 with a “−”), the controller 26 can cause the foam process 300proceed to step 314. At step 314, the foam process 300 ends.

Referring again to FIG. 2B, the upper mold 30 and the lower open-toppedmold 20 can be cooled to a cooling temperature at step 180. The coolingtemperature can be any temperature suitable to solidify the aggregatematerial 60 into a stable product for handling or further processing.For example, the cooling temperature can be in one embodiment from about30° C. to about 80° C., and in another embodiment, for example, about50° C. such as for a process recipe for making a building board.

As the foam 54 is cooled, the foam 54 may contract to reduce the backpressure upon the upper mold 30 and the lower open-topped mold 20. Theupper mold 30 and the lower open-topped mold 20 can be moved inward withrespect to one another based upon the back pressure. Accordingly, thelower open-topped mold 20 and the upper mold 30 can maintain closecontact with the heat moldable material 40 during cooling, for example,as discussed hereafter. It is to be appreciated that by close contact itis meant that the upper mold 30 maintains contact substantially over theentire surface area of the upper surface 48 of the building materialduring at least the cooling process such that bowing i.e.,distortion/movement of portions of the cooling building material in orout of the general contours defined by the facing surfaces of the upperand lower molds, is substantially prevented.

Referring collectively to FIGS. 1 and 5, the heat moldable material 40can be cooled according to a cooling process 400. At step 402, coolingdevices 16 may be activated by the controller 26 to cool the loweropen-topped mold 20 and the upper mold 30. At step 404, the controller26 can receive a cooling force measurement from the pressure sensor 34.The controller 26 can determine if the cooling force measurement is lessthan the foam force limit. If the cooling force measurement is less thanthe foam force limit (indicated in FIG. 5 with a “+”), the controller 26can cause the cooling process 400 to proceed to step 406. If the coolingforce measurement is greater than or equal to the foam force limit(indicated in FIG. 5 with a “−”), the controller 26 can cause thecooling process 400 to proceed to step 410.

At step 406, the controller 26 can receive a position measurement fromthe position sensor 36. The controller 26 can determine if the positionindicates that the heat moldable material 40 is greater than a nominalthickness. If the measured thickness is greater than the nominalthickness (indicated in FIG. 5 with a “+”), the controller 26 can causethe cooling process 400 to proceed to step 408. If the measuredthickness is less than or equal to the nominal thickness (indicated inFIG. 5 with a “−”), the controller 26 can cause the cooling process 400to proceed back to step 404.

At step 408, the controller 26 can cause the actuation assembly 12 toincrementally generate relative inward motion between the loweropen-topped mold 20 and the upper mold 30. The size of the increment maybe set such that, in operation, the molds move at a rate sufficient torespond to the rate of contraction of the foaming agent during thecooling process. Following step 408, the controller 26 can cause thecooling process 400 to proceed back to step 404.

At step 410, the controller 26 can receive a temperature measurementfrom the temperature sensor 38. The controller 26 can determine if thetemperature measurement indicates that the heat moldable material 40 isgreater than the cooling temperature. If the temperature measurement isgreater than the cooling temperature (indicated in FIG. 5 with a “+”),the controller 26 can cause the cooling process 400 to proceed back tostep 404. If the temperature measurement is less than or equal to thecooling temperature (indicated in FIG. 5 with a “−”), the controller 26can cause the cooling process 400 to proceed to step 412. At step 412,the cooling devices 16 may be deactivated by the controller 26. Thecooling process 400 can then proceed to step 414, where the coolingprocess 400 terminates.

It is to be appreciated that the above described process may be used inone embodiment according to a process recipe for making a buildingboard, that is also described above, to form such building boards havinga total thickness of about 18 mm (about ¾ inch), skin layers from about1 to about 1½ mm thick and a core layer about 15 mm thick. Such buildingboards can be made up to about 10 cm total thickness with skin layersfrom about 0.5 mm to about 7 mm thick following the described processrecipe. It is noted that various attributes of the process recipe suchas, but not limited to, temperatures, forces, thicknesses, inwardincrements, and outward increments can be adjusted to achieve otherdesired output aggregate materials, such as for example, simulatenatural stone, simulated natural brick, simulated stone veneer,simulated brick veneer, tile, simulated natural timber, siding,engineered lumber, and any other such desiredmanufactured/composite/layered building material. Moreover, it is notedthat the process recipe may depend upon the attributes (e.g., size,shape, amount, proportion, chemistry) of the fine grain material, thecoarse grain material, the foaming agent, and/or the filler material.

Referring again to FIG. 1, a heat moldable material 40 may be formed, asdescribed herein, into an aggregate material 60 comprising a lower skinlayer 62, an upper skin layer 66, and a core layer 64 integrally formedthere between. The lower skin layer 62 can form a lower surface 70 andthe upper skin layer 66 can form an upper surface 68. Each of the lowersurface 70 and the upper surface 68 can be formed into a desired shapeaccording to the molding systems described herein. The core layer 64 mayhave cellular voids formed therein, which may yield a relatively lightstructure, e.g., as compared to a corresponding natural buildingmaterial. Moreover, the core layer may be impregnated with fillermaterial as described herein.

The aggregate material 60 can be removed from the system 10 via ejectorpins (not depicted) integral with the lower open-topped mold 20 and/orthe upper mold 30. Alternatively or additionally, the lower open-toppedmold 20 and/or the upper mold 30 can be heated by the heating system toa temperature that facilitates removal. In some embodiments, the base 25and the sidewalls 24 of the lower open-topped mold may move relative toone another to eject the aggregate material 60. For example, the base 25may slide vertically. In embodiments where the sidewalls 24 are shapedto impart features upon the aggregate material 60 (e.g., tongues and/orgrooves), the sidewalls 24 may be removed and or rotate about the base25. It is noted that the aggregate materials 60 can be formed with abatch processing layout where powder dosing, mold interlocking, heating,pressing, cooling, and/or removal are each performed at separatelocations along a production line and/or by different machines.

It is noted that the terms “substantially” and “about” may be utilizedherein to represent the inherent degree of uncertainty that may beattributed to any quantitative comparison, value, measurement, or otherrepresentation. These terms are also utilized herein to represent thedegree by which a quantitative representation may vary from a statedreference without resulting in a change in the basic function of thesubject matter at issue.

Furthermore, it is noted that the embodiments described herein have beenprovided with an xyz coordinate system for clarity. Accordingly, the xyzcoordinate system can be transformed into any other coordinate systemwithout departing from the scope of the description. Moreover,directional terms such as vertical, lateral, inward, outward, and thelike have been described with respect to the provided coordinate systemand are not intended to be limiting.

While particular embodiments have been illustrated and described herein,it should be understood that various other changes and modifications maybe made without departing from the spirit and scope of the claimedsubject matter. Moreover, although various aspects of the claimedsubject matter have been described herein, such aspects need not beutilized in combination. It is therefore intended that the appendedclaims cover all such changes and modifications that are within thescope of the claimed subject matter.

1. A system for forming aggregate materials comprising: a loweropen-topped mold for receiving a heat moldable material comprising afoaming agent; an upper mold that cooperates with the lower open-toppedmold to form an enclosure; an actuation assembly coupled to the loweropen-topped mold, the upper mold, or both to generate relative inwardmotion between the lower open-topped mold and the upper mold andrelative outward motion between the lower open-topped mold and the uppermold; a heating system in thermal communication with the loweropen-topped mold and the upper mold; a pressure sensor operably coupledto the lower open-topped mold, the upper mold, or both, wherein thepressure sensor transmits a pressure signal indicative of back pressureprovided by the heat moldable material; and a controller communicativelycoupled to the actuation assembly and the heating system, wherein whenthe heat moldable material is received by the lower open-topped mold,the controller executes machine readable control logic to: generaterelative inward motion of the lower open-topped mold and the upper moldwith the actuation assembly to enclose the heat moldable material,wherein the lower open-topped mold contacts the heat moldable materialand the upper mold contacts the heat moldable material; heat the loweropen-topped mold and the upper mold with the heating system to a foamingtemperature, wherein the foaming temperature fuses the heat moldablematerial and activates the foaming agent; receive the pressure signalfrom the pressure sensor; and cause the actuation assembly to generaterelative outward motion at an expansion rate, wherein the foaming agentexpands the heat moldable material, the lower open-topped mold maintainsclose contact with the heat moldable material, the upper mold maintainsclose contact with the heat moldable material, and the expansion rate ofthe relative outward motion is based upon the pressure signal.
 2. Thesystem of claim 1, further comprising a cooling system communicativelyto the controller and coupled in thermal communication with the loweropen-topped mold and the upper mold, wherein the controller executesmachine readable control logic to: cool the lower open-topped mold andthe upper mold from the foaming temperature to a cooling temperaturewith the cooling system; and generate relative inward motion of thelower open-topped mold and the upper mold at a contraction rate with theactuation assembly, wherein the lower open-topped mold maintains closecontact with the heat moldable material, the upper mold maintains closecontact with the heat moldable material, and the contraction rate of therelative outward motion is based upon the pressure signal.
 3. The systemof claim 2, wherein the cooling temperature is from about 50° C. toabout 80° C.
 4. The system of claim 1, wherein the controller executesmachine readable control logic to heat the lower open-topped mold andthe upper mold to a pre-heat temperature with the heating system,wherein the pre-heat temperature fuses the heat moldable material anddoes not activate the foaming agent.
 5. The system of claim 4, whereinthe pre-heat temperature is from about 130° C. to about 310° C.
 6. Thesystem of claim 1, wherein the heat moldable material comprises a lowerlayer and an upper layer of relatively fine grain material, and a corelayer of relatively coarse grain material disposed between the lowerlayer and the upper layer such that the core layer comprises the foamingagent.
 7. The system of claim 6, wherein the heat moldable materialcomprises a thermoplastic powder.
 8. The system of claim 7, wherein thelower layer and the upper layer of the heat moldable material each hasan average grain size of about 100 μm to about 3,000 μm.
 9. The systemof claim 7, wherein the core layer of the heat moldable material has anaverage grain size of up to about 10 cm.
 10. The system of claim 1,wherein the lower open-topped mold comprises one or more sidewalls and abase that cooperates with the one or more sidewalls to form a moldshape.
 11. The system of claim 10, wherein the one or more sidewalls andthe base of the lower open-topped mold move with respect to one another.12. The system of claim 10, wherein the base of the lower open-toppedmold is substantially smooth.
 13. The system of claim 1, wherein theactuation assembly comprises one or more linear actuators.
 14. Thesystem of claim 1, wherein the heating system comprises a heating devicedisposed within the lower open-topped mold, the upper mold, or both. 15.The system of claim 1, further comprising a lower support structuremovingly engaged with a conveyance system, wherein the lower open-toppedmold is coupled to the lower support structure.
 16. The system of claim15, further comprising a position sensor operably coupled to the loweropen-topped mold and communicatively coupled to the controller, whereinthe position sensor transmits a signal indicative of a lateral locationof the lower open-topped mold.
 17. The system of claim 1, furthercomprising a position sensor operably coupled to the upper mold andcommunicatively coupled to the controller, wherein the position sensortransmits a signal indicative of a vertical location of the upper mold.18. The system of claim 1, wherein the foaming temperature is less thanabout 350° C.
 19. A system for forming aggregate materials comprising: alower open-topped mold for receiving a heat moldable material comprisinga lower layer and an upper layer of relatively fine grain material, anda core layer of relatively coarse grain material disposed between thelower layer and the upper layer, the core layer comprising a foamingagent; an upper mold that cooperates with the lower open-topped mold toform an enclosure; an actuation assembly coupled to the loweropen-topped mold, the upper mold, or both to generate relative inwardmotion between the lower open-topped mold and the upper mold andrelative outward motion between the lower open-topped mold and the uppermold; a heating system in thermal communication with the loweropen-topped mold and the upper mold; a pressure sensor operably coupledto the lower open-topped mold, the upper mold, or both, wherein thepressure sensor transmits a pressure signal indicative of back pressureprovided by the heat moldable material; and a controller communicativelycoupled to the actuation assembly and the heating system, wherein whenthe heat moldable material is received by the lower open-topped mold,the controller executes machine readable control logic to: generaterelative inward motion of the lower open-topped mold and the upper moldwith the actuation assembly to enclose the heat moldable material,wherein the lower open-topped mold contacts the heat moldable materialand the upper mold contacts the heat moldable material; heat the loweropen-topped mold and the upper mold to a pre-heat temperature with theheating system, wherein the pre-heat temperature fuses the upper layerand/or the lower layer of the heat moldable material and does notactivate the foaming agent; heat the lower open-topped mold and theupper mold from the pre-heat temperature to a foaming temperature withthe heating system, wherein the foaming temperature activates thefoaming agent; receive the pressure signal from the pressure sensor; andgenerate relative outward motion of the lower open-topped mold and theupper mold at an expansion rate with the actuation assembly, wherein thefoaming agent expands the heat moldable material, the lower open-toppedmold maintains close contact with the heat moldable material, the uppermold maintains close contact with the heat moldable material, and theexpansion rate of the relative outward motion is based upon the pressuresignal.
 20. The system of claim 19, further comprising a cooling systemcommunicatively to the controller and coupled in thermal communicationwith the lower open-topped mold and the upper mold, wherein thecontroller executes machine readable control logic to: cool the loweropen-topped mold and the upper mold from the foaming temperature withthe cooling system; and generate relative inward motion of the loweropen-topped mold and the upper mold at a contraction rate with theactuation assembly, wherein the lower open-topped mold maintains closecontact with the heat moldable material, the upper mold maintains closecontact with the heat moldable material, and the contraction rate of therelative outward motion is based upon the pressure signal.
 21. A systemfor forming aggregate materials comprising: a lower open-topped mold forreceiving a heat moldable material comprising a foaming agent; an uppermold that cooperates with the lower open-topped mold to form anenclosure; an actuation assembly coupled to the lower open-topped mold,the upper mold, or both to generate relative inward motion between thelower open-topped mold and the upper mold and relative outward motionbetween the lower open-topped mold and the upper mold; a heating systemin thermal communication with the lower open-topped mold and the uppermold; a cooling system in thermal communication with the loweropen-topped mold and the upper mold; a pressure sensor operably coupledto the lower open-topped mold, the upper mold, or both, wherein thepressure sensor transmits a pressure signal indicative of back pressureprovided by the heat moldable material; and a controller communicativelycoupled to the actuation assembly, the heating system, and the coolingsystem wherein when the heat moldable material is received by the loweropen-topped mold, the controller executes machine readable control logicto: generate relative inward motion of the lower open-topped mold andthe upper mold with the actuation assembly to enclose the heat moldablematerial, wherein the lower open-topped mold contacts the heat moldablematerial and the upper mold contacts the heat moldable material; heatthe lower open-topped mold and the upper mold to a pre-heat temperaturewith the heating system, wherein the pre-heat temperature fuses the heatmoldable material and does not activate the foaming agent; heat thelower open-topped mold and the upper mold from the pre-heat temperatureto a foaming temperature with the heating system, wherein the foamingtemperature activates the foaming agent; receive the pressure signalfrom the pressure sensor; generate relative outward motion of the loweropen-topped mold and the upper mold at an expansion rate with theactuation assembly, wherein the foaming agent expands the heat moldablematerial, the lower open-topped mold maintains close contact with theheat moldable material, the upper mold maintains close contact with theheat moldable material, and the expansion rate of the relative outwardmotion is based upon the pressure signal; cool the lower open-toppedmold and the upper mold from the foaming temperature with the coolingsystem; and generate relative inward motion of the lower open-toppedmold and the upper mold at a contraction rate with the actuationassembly, wherein the lower open-topped mold maintains close contactwith the heat moldable material, the upper mold maintains close contactwith the heat moldable material, and the contraction rate of therelative outward motion is based upon the pressure signal.